CC8000模组规格书

更新时间2020-11-24T09:01:25Z

cc8000模组规格书icon-link

LDI12B000A

WIFI+BLE Module Specification

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1-overviewicon-link

LDI12B000A is a LEEDARSON self-developed, small size, and low-power WIFI + BLE module. It integrates CC8000QN32 solution from C-chip Semiconductor Inc., The CC8000 supports 802.11b/g/n Wi-Fi system, with HT20 capability. The integrated Bluetooth low energy 4.2 shares the single antenna port with Wi-Fi transceiver, and both Wi-Fi and Bluetooth could work simultaneously with precise time multiplexing.

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12-key-featuresicon-link

u Support 802.11b/g/n compatible WLAN and Bluetooth low energy 4.2

u 802.11 b/g/n 1x1 compliant

u Embedded a 32-bit MCU up to 180MHz

u Program memory: internal 2MB Flash

u Data memory: 512 KB internal data RAM

u Frequency of crystal oscillator: 26MHz;

u Interface: 5 PWMs/ 1 I2C / 7 GPIOs/2 UARTs

u Power supply voltage: 3.0V~3.6V

u Operating temperature: -40℃~105℃

u Storage Temperature:-55℃~125℃

u Operating frequency: 2400~2483.5MHz

u Modulation:802.11b(DSSS):CCK(11,5.5Mbps),DQPSK(2Mbps),DBPSK(1Mbps); 802.11g(OFDM):BPSK(9,6Mbps),QPSK(18,12Mbps),16QAM(36,24Mbps),64QAM(54,48 Mbps);

802.11n(OFDM):BPSK,QPSK,16QAM ,64QAM(65Mbps);BLE4.2 (GFSK);

u WIFI Rate:

802.11b:11, 5.5,2,1 Mbps

802.11g: 54,48,36,24,18,12,9,6 Mbps

802.11n: up to 65Mbps

u WIFI TX output power: 802.11b:17dBm (Typical) 802.11g:14dBm (Typical) 802.11n:13dBm (Typical)

u WIFI Receiving sensitivity :

(802.11b@8% PER) 1Mbps:-90dBm; 11Mbps:-87dBm (802.11g@10% PER) 6Mbps:-89dBm; 54Mbps:-71dBm (802.11n@10% PER) MCS0:-86dBm; MCS7:-68dBm

u WIFI 802.11b Transmitting mode current(peak): 360mA@17dBm

u WIFI 802.11b Receiving mode current(average):107mA

u BLE TX output power : 9dBm(Typical)

u Bluetooth Rate: LE: 1Mbps

u BLE Receiving sensitivity@1Mbit/s: -85dBm

u BLE Transmitting mode current(peak): 240mA@9dBm

u BLE Receiving mode current(average):160mA

u Deep sleep mode current: 15mA

13-functional-block-diagramicon-link

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LDI12B000A module is designed to offer high integration and ultra-low power. It

integrates hardware and software component to finish a complete 802.11b/g/n audio and video application, which supports AP and STA role simultaneously, and integrates Bluetooth low energy transceiver. The high speed 32-bit MCU and large embedded RAM make it able to support multiple cloud links and also suitable for audio and image application.

14-product-applicationicon-link

LDI12B000A is a WIFI+BLE wireless communication module, which needs an external 2.4G antenna for wireless communication. It provides a variety of interfaces for product applications such as a pair of I2C interfaces, 5 PWMs interface, 7 GPIOs interface, and two pairs of UART.

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LDI12B000A module can be used in smart products such as plug, sensor, switch and gateway,etc.

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​ Plug Sensor Switch Gateway

15-ordering-informationicon-link

Ordering Code Protocol Stack IC Solution Operating Temperature Dimension Version
LDI12B000A WIFI+BLE4.2 CC8000QN32 -40℃ ~ 105℃ 12mm*15mm A

2-technical-specificationicon-link

21-radio-frequency-parametersicon-link

Table 1

Parameter Value
Protocol IEEE 802.11b/g/n WIFI and BLE 4.2
Modulation 802.11b(DSSS):CCK(11,5.5Mbps),DQPSK(2Mbps),DBPSK(1 Mbps); 802.11g(OFDM):BPSK(9,6Mbps),QPSK(18,12Mbps),16QAM( 36,24Mbps),64QAM(54,48Mbps); 802.11n(OFDM):BPSK,QPSK,16QAM ,64QAM(65Mbps);
BLE(GFSK);
Channel Number USA/Canada: WIF channel 111 Europe/China/Australia: WIFI channel 113 Japan: WIFI channel 114 BLE:039
Channel Bandwidth WIFI:20MHz BLE:2MHz
Basic Transmitting Rate WIFI 802.11b:11,5.5,2,1 Mbps WIFI 802.11g:54,48,36,24,18,12,9,6 Mbps WIFI 802.11n:up to 65Mbps BLE:1Mbps
Parameter Min. Typ. Max. Unit
Frequency 2400 -- 2483.5 MHz
WIFI 11b TX Power 15 17 19 dBm
WIFI 11g TX Power 12 14 16 dBm
WIFI 11n TX Power 10 12 14 dBm
WIFI Receiving Sensitivity@11b 1Mbps -- -- -91 dBm
WIFI Receiving Sensitivity@11b 11Mbps -- -- -88 dBm
WIFI Receiving Sensitivity@11g 6Mbps -- -- -90 dBm
WIFI Receiving Sensitivity@11g 54Mbps -- -- -73 dBm
WIFI Receiving Sensitivity@11n20 MCS0 -- -- -88 dBm
WIFI Receiving Sensitivity@11n20 MCS7 -- -- -69 dBm
BLE TX Power 7 9 10 dBm
BLE Receiving Sensitivity@1Mbit/s -- -- -88 dBm
Remark: Above data are based on 25℃ ambient temperature and 3.3V supply voltage;

22-pin-definitionicon-link

221-default-and-multiplexing-pin-definitionicon-link

There are 35 pins in LDI12B000A module, refer to below chart 7 & chart 8 for pin definition. “Default Pin Definition” in Chart 9 means the recommended pin function definition. Usually, customers need to choose target pins according to the pin definition in this column of Chart 8.

In some special projects, if "default pin definition" can’t meet the needs of products, then "Multiplexing Pin Definition" function can be chosen. However, when choosing this multiplexing function, need to consider whether other modules that have the same package, also have the same multiplexing function.

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Module Pin Number Pin of IC Default Pin Definition Pin Function Description Multiplexing Pin Definition
1 P28/RX_EN/U SBDN GPIO1 General purpose input/output GPIO
2 P14/SD_CLK/ SPI_SCK/QS PI_FLASH_C LK GPIO2 General purpose input/output GPIO
3 P9/BT_PRIO RITY/PWM3 PWM1 Pulse width modulation, PWM signal output GPIO
4 P8/BT_ACTIV E/PWM2 PWM2 Pulse width modulation, PWM signal output GPIO
5 P7/WIFI_ACT IVE/PWM1 PWM3 Pulse width modulation, PWM signal output GPIO
6 P24/LPO_CL K/PWM4/QSP I_RAM_CLK PWM4 Pulse width modulation, PWM signal output GPIO
7 -- NC -- --
8 P26/IRDA/PW M5/QSPI_RA M_CSN PWM5 Pulse width modulation, PWM signal output GPIO
9 P1/UART2_R X/I2C2_SDA UART_RX0 Universal asynchronous receiver Program burning pin for module; Download mode
10 -- NC -- --
11 P0/UART2_T X/I2C2_SCL UART_TX0 Universal asynchronous transmitter Program burning pin for module; Download mode
12 P21/I2C1_SD A/JTAG_TMS/ QSPI_IO2 I2C_SDA I2C Data pin GPIO(If the pin is used for control applications,such as lamp control,it needs to be connected to a 10k resistor to
effectively pull up)
13 P20/I2C1_SC L/JTAG_TCK/ QSPI_IO3 I2C_SCK I2C Clock pin GPIO(If the pin is used for control applications,such as lamp control,it needs to be connected to a 10k resistor to effectively pull up)
14 GND GND Ground --
15 P22/CLK_26 M/JTAG_TDI/ QSPI_IO1 GPIO7 General purpose input/output GPIO
16 -- NC -- --
17 -- NC --
18 P6/CLK13M/P WM0 GPIO6 General purpose input/output GPIO
19 CEN CEN Chip reset --
20 GND GND Ground --
21 1_VCCRXFE ;3_ VCCPA;4_ VCCPAD;5_ VCCIF;6_ VSYS;7_ VDDDIG;8_ VDDAON;9_ VBAT;32_ VCCPLL VCC Power supply, DC power supply 3.3V --
22 -- NC -- --
23 P23/ADC3/JT AG_TDO/QPI O_IO0 ADC3 General purpose input/output --
24 P10/UART1_ RX UART_RX1 Universal asynchronous receiver --
25 P11/UART1_ TX UART_TX1 Universal asynchronous transmitter --
26 -- NC -- --
27 P17/SD_D0/S GPIO5 General purpose GPIO
PI_MISO/QS PI_IO1 input/output
28 P15/SD_D3/S PI_CSN/QSPI _FLASH_CS N GPIO4 General purpose input/output GPIO
29 P16/SD_CMD /SPI_MOSI/Q SPI_IO0 GPIO3 General purpose input/output GPIO
30 -- NC -- --
31 GND GND Ground --
32 GND GND Ground --
33 2_ ANT RF RF signal transmission and reception --
34 GND GND Ground --
35 GND GND Ground --
Remark: For a more detailed definition of multiplexing pin, please refer to the IC datasheet.

222-pin-to-pin-module-replacement-introductionicon-link

“Pin to Pin” module means different modules with same default pin definition function which have same package, except for burning and NC pins. When choosing “Multiplexing Pin Definition” function, should ensure that other same package modules have the same multiplexing function.

We already have “Pin to Pin” modules, such as “LBS61B000A”, “LDS73B000A”, and “LWK32B500A”; and tend to add more in the future. Below chart is a comparison of default pin definitions for the "Pin to Pin" module.

Module Pin Number Definition of Default Pin
LDI12B000A LBS61B000A LDS73B000A LWK32B500A TBD
1 GPIO GPIO GPIO NC --
2 GPIO GPIO GPIO GPIO3 --
3 PWM1 PWM1 PWM1 PWM1 --
4 PWM2 PWM2 PWM2 PWM2 --
5 PWM3 PWM3 PWM3 PWM3 --
6 PWM4 PWM4 PWM4 PWM4 --
7 NC GPIO GPIO NC --
8 PWM5 GPIO GPIO GPIO4 --
9 RX0 Burning RX0 RX0 Burning RX2 Burning --
10 NC GPIO GPIO NC --
11 TX0 Burning TX0 TX0 Burning TX2 Burning --
12 I2C_SDA I2C_SDA I2C_SDA GPIO2 --
13 I2C_SCK I2C_SCL I2C_SCL GPIO1 --
14 GND GND GND GND --
15 GPIO GPIO GPIO NC --
16 NC GPIO GPIO NC --
17 NC SW_CLK Burning SW_CLK NC --
18 GPIO SW_TMS Burning SW_TMS NC --
19 CEN RESET RESET CHIP_EN --
20 GND GND GND GND --
21 VCC VCC VCC VCC --
22 NC NC ADC4 NC --
23 ADC3 NC ADC3 ADC --
24 RX1 RX/ADC2 RX/ADC2 RX0 --
25 TX1 TX/ADC1 TX/ADC1 TX0 --
26 NC GPIO NC NC --
27 GPIO GPIO NC NC --
28 GPIO GPIO NC NC --
29 GPIO NC NC NC --
30 NC NC NC NC --
31 GND GND GND GND --
32 GND GND GND GND --
33 RF RF RF RF --
34 GND GND GND GND --
35 GND GND GND GND --

23-electrical-performanceicon-link

Parameter Unit Min. Typ. Max. Remark
Power Supply V 3.0 3.3 3.6 Ripple voltage of power supply
Voltage should be less than 250mV.
Deep Sleep Current uA -- 10 -- Deep sleep mode.
WIFI 1M TX Peak Current mA -- -- 360 current in TX test mode @802.11b 1M
WIFI 1M TX Average Current mA -- 300 -- current in TX test mode @802.11b 1M
WIFI 1M RX Current mA -- 107 -- current in RX test mode @802.11b 1M
WIFI 11M TX Peak Current mA -- -- 360 current in TX test mode @802.11b 11M
WIFI 11M TX Average Current mA -- 290 -- current in TX test mode @802.11b 11M
WIFI 11M RX Current mA -- 107 -- current in RX test mode @802.11b 11M
WIFI 54M TX Peak Current mA -- -- 360 current in TX test mode @802.11g 54M
WIFI 54M TX Average Current mA -- 270 -- current in TX test mode @802.11g 54M
WIFI 54M RX Current mA -- 108 -- current in RX test mode @802.11g 54M
WIFI MCS7 HT20 TX Peak Current mA -- -- 340 current in TX test mode @802.11n MCS7 HT20
WIFI MCS7 HT20 TX Average Current mA -- 258 -- current in TX test mode @802.11n MCS7 HT20
WIFI MCS7 HT20 RX Current mA -- 107 -- current in RX test mode @802.11n MCS7 HT20
BLE TX Peak Current mA -- -- 240 Average current in TX test mode@9dBm.
BLE TX Average Current mA -- 135 -- Average current in TX test mode@9dBm.
BLE RX Current mA -- 160 -- Average current in RX test mode.
Remark: 1. Suggested that driving current should not be less than 500 mA;

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24-operating-conditionicon-link

Parameter Unit Min. Typ. Max. Remark
Operating Temperature -40 -- 105 The ambient temperature on components of LDI12B000A when the module is working.
Storage Temperature -55 25 125 Recommend to store it in antistatic vacuum bag at 25℃.
Operating Humidity % 10 -- 90 Relative humidity.
Storage Humidity 10 -- 90 Relative humidity.

Chart 11.Operating Condition

25-pcb-featuresicon-link

PCB Material Number of Layers Surface Finish Thickness mm Solder Color Color of Character Special Technology
FR-4 4 Immersion Gold 0.8 Black White 50Ω Impedance

3--mechanical-dimensionicon-link

31-single-module-dimensionicon-link

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Chart 13.Single Module Dimension(Unit: mm)

32-layout-package-suggestionicon-link

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Symbol Dimension**(mm)** Dimension**(mil)**
Min. Typ. Max. Min. Typ. Max.
A 11.9 12 12.1 468.50 472.44 476.38
A1 1.1 1.2 1.3 43.31 47.24 51.18
A2 1.1 1.2 1.3 43.31 47.24 51.18
B 14.9 15 15.1 586.61 590.55 594.49
B1 1.4 1.5 1.6 55.12 59.06 63
B2 1.4 1.5 1.6 55.12 59.06 63
C 14.9 15 15.1 586.61 590.06 594.49
C1 1.4 1.5 1.6 55.12 59.06 63
C2 1.4 1.5 1.6 55.12 59.06 63
D 11.9 12 12.1 468.50 472.44 476.38
D1 1.1 1.2 1.3 43.31 47.24 51.18
D2 1.7 1.8 1.9 66.93 70.87 74.80
D3 6.5 6.6 6.7 255.91 259.84 263.78
d 1.1 1.2 1.3 43.31 47.24 51.18
a 0.7 0.8 0.9 27.56 31.50 35.43
b 1.5 1.6 1.7 59.06 63 66.93

4--application-notesicon-link

41-suggestion-on-backplane-designicon-link

411-antenna-matching-network-reservedicon-link

A 2.4GHz antenna is needed in the driver backplane and the antenna is designed according to different product structures and driving schemes, to ensure the best wireless communication performance of each kind of product. Here are the suggestions for antenna design as below:

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Chart 16.Module Application Diagram(Unit: mm)

\1. An avoidance area is recommended to be reserved for antenna design, and it should be as close as possible to the edge of the backplane; See more details in chapter 4.1.2;

\2. It is necessary to reserve a ‘π’ matching network for antenna impedance matching.

\3. The path of ‘π’ network components must be designed to be 50Ω impedance.

412-antenna-design-recommendationicon-link

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Chart 17.Recommended antenna design

The 2.4 GHz antenna which used cooperatively with the LDI12B000A module is to be designed according to the whole product environment. Different antenna performance would cause wireless communication distance difference.

Below are the antenna parameters typical value recommended.

Parameter Value
Frequency Range 2.4 ~ 2.5GHz
Impedance 50 Ohm
VSWR 2.0(Max.)
Return Loss -10 dB (Max.)
Antenna Gain 0~2dBi peak gain
Antenna Type Integrated PCB antenna
Efficiency >30%

Chart 18.Recommended Antenna Parameters

In addition, there are some guidelines that need to be taken into consideration.

\1. Make sure that antenna is not in contact with any kind of metal.

\2. The antenna should be places as far away from any metal structures as possible. At least 10 mm away is needed.

\3. Antenna types having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this module. Under FCC/CE/ISED regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by FCC/CE/ISED. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropic radiated power (e.i.r.p.) is not more than that necessary for successful communication.

The below charts shows the way of application for SMT Crafts:

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Chart 19.Schematic diagram of SMT Crafts application

42-suggestions-on-smt-temperature-settingicon-link

Refer to below information for SMT temperature setting.

Setpoints()
Zone 1 2 3 4 5 6 7 8 9 10
Top 140 180 190 180 180 190 245 260 265 210
Bottom 140 180 190 180 180 190 245 260 265 210
Conveyor Speed(cm/min):130.0

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